Elementos fundamentales

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Nombre de código
Estado
Launched
Fecha de lanzamiento
Q4'17
Discontinuidad prevista
2023
Anuncio EOL
Friday, May 5, 2023
último pedido
Friday, June 30, 2023
Elementos incluidos
(1) Metal shipping bracket(2) Non-Intel GPGPU secure mounting adaptersNote: Intel Xeon Phi cards with active heat sinks are NOT supported in systems configured with the high air flow air duct. Note: Systems configured with any type of Intel® Xeon Phi™ card and/or non-Intel GPGPU card must have the shipping bracket installed before the system is exposed to any level of shock or vibration or is shipped to the end user location. Failure to install the shipping bracket has the potential to cause serious damage to various components within the system.
Fecha de vencimiento de la disponibilidad del nuevo diseño
Wednesday, October 12, 2022

Información complementaria

Descripción
High Air Flow Air Duct Bracket Kit when when installing an Intel® Xeon Phi™ coprocessor with passive heat sink (heat sink only, no fan) or non-Intel GPGPU with passive heat sink with the 2000WF Family