Intel® 32nm Logic and SOC Technologies
Revolutionary breakthrough for improved performance and energy efficiency
Intel’s 32nm processes, which are currently in high volume production, are part of an on-going evolution of manufacturing technologies. With the introduction of a new process family every two years, Intel manufacturing technologies facilitate ever higher-performing and more energy-efficient products.
The innovative 32nm logic technology is a revolutionary technical breakthrough. Incorporating 2nd-generation high-k metal gate transistors, it delivers record NMOS and PMOS transistor performance, as measured by drive current. It also has the highest reported density of any 32nm or 28nm technology, as measured by both SRAM array density and gate pitch.
Intel has also developed a full-featured system-on-a-chip (SOC) 32nm process technology to complement the logic technology. This new technology integrates ultra-low power transistors with low standby/always-on circuit applications and high-voltage I/O transistors. It enables development of more robust, capable, and energy efficient computing devices with a much smaller footprint. As part of the evolution of the Intel tick-tock model, Intel engineers and scientists will continue to develop a SOC process alongside each logic process.
Moore's Law and the future
The Intel® 32nm process continues to transform the way we live, work, and communicate by delivering on the expectations of Moore's Law. With breakthrough 32nm logic technology, users can expect faster processing speeds, better energy efficiency, greater computing capability, improved functionality, and support for more sophisticated applications.
The Intel® 32nm logic process with 2nd generation high-k + metal gate transistors is a world first. This white paper provides an overview.