Recently named one of the top 50 most creative people in Business (Fast Company,) Genevieve Bell is an Intel Fellow and director... (4:52)
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Intel IT’s approach to PC refresh and Ultrabook™ deployment
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Mandarin: Guide to LGA115X socket independent loading mechanism installation.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Compares cost of buying one Ultrabook™ device to both laptops and tablets for each employee. (3:07)
Using Intel® Intelligent Power Node Manager on Intel® Xeon® 5500 Processor Series Platforms. Energy Efficiency, Power Capping... (2:16)