La versión del navegador que está utilizando no es aconsejable para este sitio.
Considere actualizar a la última versión de su navegador haciendo clic en uno de los enlaces siguientes.

Intel® Package on Package (PoP) BGA Rework Video

Intel has developed the processes to remove and replace high density electronic components packaged in a Ball Grid Array, or BGA format. For Package-on-Package, or “PoP” devices, these guidelines include: developing the proper thermal reflow profile, the correct PCB pad site dress and cleaning, and new component preparation methods.