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Environmental Citizenship

Intel expands its environmental focus to include the impact from electronics manufacturing and electronic products.

Non-Destructive Testing

Non-destructive techniques like X-ray, SAM, SQUID, TDR, and thermal imaging provide data without altering the electronic device; details provided.

Parametric Fault Isolation

Parametric fault isolation analyzes electrical behavior of input/output circuitry using an SPA; includes graph.

Photon Emission and Probing Analysis

IC device functional analysis uses several methods to analyze light emissions, measure wave-forms, or alternate functional state; methods described.

Physical and Composition Analysis

Describes focused ion beam, scanning electron microscopy, and transmission electron microscopy tools used in physical and composition analysis.

Intel ofrece soluciones de gestión de TI para las PYME

Caso práctico: Brookwood School utiliza servidores equipados con el procesador Intel® Xeon® y equipos de sobremesa equipados con el procesador Intel® Core™2 Duo para conseguir unas soluciones de TI económicas.

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Intel® 631xESB/632xESB I/O Controller Hub: Datasheet

Datasheet: Intel® 631xESB/ 632xESB I/O Controller Hub covers signal and functional descriptions, mechanical specifications, registers, and more.

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Intel® 631xESB/632xESB I/O Controller Hub: Thermal Guide

Thermal and Mechanical Design Guide: Intel® 631xESB and 632xESB I/O Controller Hub.

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Intel® 631xESB / 632xESB I/O Controller Hub (ESB2)

Specification Update, 2009: Intel® 631xESB / 632xESB I/O Controller Hub (ESB2), device and document errata and specification changes.

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IRC Fab Equipment List, April 2012

Chart: lists supplier, model number, description, Ceid, wafer size and functional area of IRC Fab equipment.

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