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Corner Glue: Application Techniques and Materials

Reviews corner glue use as a component to reduce soldering joint strain, material selection criteria, and demonstrates proper application techniques.

Electrostatic Discharge Prevention Methods

Intel’s ESD prevention methods prevent costly damage to electronic devices; overview provides device models, theory, and case studies.

Ball Grid Array Rework: Package-on-Package Devices

Package-on-package device rework demos developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.

Intel Online Events

Watch and listen to Intel-hosted webinars and online events, and learn about innovative technologies, new products, and evolving trends.

Descripción de la compañía Intel

Conozca Intel en esta introducción a la empresa que explora innovaciones en tecnología, biografías de los ejecutivos, puestos disponibles y enlaces a redes sociales.

Diversidad e integración global de Intel

Descubra cómo Intel está convirtiendo las diferencias en puntos fuertes centrándose en la diversidad y la integración globales para crear una plantilla más integrada.

Intel® Embedded Design Center Privacy Statement

Review the Intel® Embedded Design Center privacy statement to understand how Intel collects, uses, and safeguards the data collected from members.

Intel Diversity Progress Report: 2015 Annual Report

After exceeding 2015 hiring goals, Intel announces new goals in the Diversity 2015 Annual Report Program Summary to keep increasing diversity hiring.

Intel Global Diversity External Alliances

Intel connects with external alliances to major national research, policy, and advisory organizations that work on behalf of diversity.

Diversity Employee Groups

Diversity Employee Groups