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Intel® Communications Chipset 89xx Series AMC Reference Design Kit

crystal-forest-amc-chipset-89xx-seriesreference-design-kit

Intel® Communications Chipset 89xx Series: Design Guide

Design Guide: Thermal and mechanical design specifications for the Intel® Communications Chipset 89xx Series. (v.001, Oct. 2012)

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Intel® Xeon® Processor E5-2600 v2 Series: Power Guidelines

Guidelines: Provides power data for the Intel® Xeon® processor E5-2600 v2 series while running real-life applications. (v.1, Aug. 2013)

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Intel® Communications Chipset 8920: Power Guide Addendum

Addendum: Provides power consumption information on the Intel® Communications Chipset 8920 while it is running on industry standard applications.

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Intel® Xeon® Processor i3-2115 C: Power Guideline Addendum

Power Guideline Addendum: Provides power numbers on the Intel® Xeon® processor i3-2115 C while running real life applications. (v.001, Aug. 2012)

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Application Power Guideline for Intel® Embedded Processors

White Paper: Application Power Guidelines based on realistic power consumption estimates for Intel® Embedded processors. (v.001, Dec. 2010)

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Advanced Board Bring Up: Power Up Sequencing Guide

White Paper: Explains power-up sequencing and debug for embedded platforms from power on to the first BIOS code fetch. (v.001, Apr. 2011)

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Embedded Intel® Architecture: Board Bring Up Procedure

White Paper: Explains motherboard stability tests and debug methods to solve issues during embedded Intel® architecture-based board bring up.

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PCB Stack-up Overview for Intel® Architecture Platforms

White Paper: PCB stack-up designs for Intel® Architecture platforms meet high-speed needs, addressing challenges with speed and costs. (Dec. 2008)

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BOM Cost Reduction: Remove Intel® Atom™ Processor E6xx S3 State

White Paper: Intel® Atom™ processor E6xx power state overview shows Bill of Materials (BOM) cost reduction by removing S3 state. (v.001, May 2011)

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